Spherical Boron Nitride Powder Description

Spherical Boron Nitride Powder possesses isotropic thermal conductivity attributed to its distinctive particle structure, addressing the limitations associated with the anisotropic thermal conductivity of flake boron nitride. It attains commendable planar thermal conductivity at a reduced filling ratio and exhibits the favorable characteristics of low density and a low dielectric constant akin to conventional boron nitride. Comparatively, at an equivalent filling amount, the thermal conductivity of Spherical Boron Nitride surpasses that of Standard Platelet Boron Nitride Powder by more than threefold.

In the SSBNL series products, the density is lower than that of SSBN, and when incorporated into a system, SSBNL displays heightened viscosity. Despite these differences, under identical filling conditions, SSBNL exhibits elevated thermal conductivity values. Consequently, SSBN fulfills the requirements for high filling, while SSBNL satisfies the criteria for achieving substantial thermal conductivity values.

Spherical Boron Nitride Powder Specifications

SSBN Typical Properties

SSBNL Typical Properties