The HTCC Aluminum Nitride Heater utilizes the superior thermal conductivity and excellent electrical insulation properties of aluminum nitride (AlN) combined with the robust, multilayer construction capabilities of High-Temperature Co-Fired Ceramic (HTCC) technology. These heaters are ideally suited for high-temperature, high-precision applications in semiconductor manufacturing, medical and laboratory equipment, aerospace, industrial heating, and optoelectronics. Their durability, efficiency, and customizable design make them invaluable in advanced technological and industrial processes.
HTCC, or High-Temperature Co-Fired Ceramic, is a technology used in the fabrication of multilayer ceramic substrates and electronic circuits. This process involves co-firing ceramic and metal layers at high temperatures, producing a highly durable and stable product suitable for high-temperature and high-performance applications.
Property | Unit | Value |
---|---|---|
Heating Material | - | AlN |
Thickness | mm | 0.8-3.0 |
Size | - | Customized |
Max. Working Temp. | ℃ | 1000 |
Density | g/cm³ | 3.3 |
Heating Speed | ℃/s | ≤120 |
Maximum Watt Density | W/cm² | 155 |
Thermal Conductivity | W/mK | 220 |
Semiconductor Manufacturing:
Medical and Laboratory Equipment:
Aerospace and Defense:
Industrial Heating:
Optoelectronics:
Our HTCC Aluminum Nitride Heater is meticulously handled during storage and transportation to maintain the product's quality and integrity.